Traditional electronics substrates, such as polyimide, PDMS, silicon, and metal foils, are costly, rigid, and poorly suited for embedding sensors into…
Fiber Impregnated Composite Analysis by Thermal Digitial Image Correlation TDIC
Continuous and discontinuous fiber reinforced composites, such as sheet molding composites (SMCs) can provide enhanced strength and weight-reduction…
Smart Pixel Circuit
Image binarization plays a crucial role in numerous AI applications, especially in computer vision applications and document analysis in image…